What are you guys using for reflowing after applying the solder paste? I see lots of info out there about using toaster ovens or hot plates, but then I read lots of issues with those as well-- not getting hot enough, burning boards, melting parts, needing to monitor board temp with a thermocouple. Seems like a bit of a dicey proposal.
Is there any reason not to just use a hot air SMT soldering station and reflow each part one at a time? It may be a little slower than a hot pad, but with paste applied through a stencil will the results be any worse/better? I'm not concerned about the time- I'm doing small boards and just a few prototypes.