I had two questions on the HPMD 24v23 (item #1456):
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How can a heatsink be attached to the board? Most TO-252 heatsinks I have seen solder to pads on either side of the device (typically the same copper pad that the large tab solders to). I could install a heatsink on top of the plastic MOSFET package, but how effective would that be?
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I would like to utilize the ACS714 current sensor, however motor and logic grounds are isolated on my system. Optically isolating the logic signals is easy enough, but the analog output from the current sensor is another matter. Is the ACS714 ground isolated? I noticed two pads on the board labeled GND, so I was hopeful.
Thanks in advance.